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|· Simple design to perfectly protect the cooling module|
|· High thermal conductive adhesive|
|· Supports Intel & AMD motherboards|
|· Supports XMP 2.0 Technology|
|· Energy saving with ultra-low working voltage|
Reinforced structure and enhanced heat dissipation
T-FORCE VULCAN Z’s all new cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering the finest and smoothest gaming experience and an extreme performance without any lag.