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|· Allows the CPU to be operated and cooled without a heatspreader|
|· Secure mounting for maximum cooling performance|
|· Compatible with current Socket 2066 motherboards|
|· Manufactured in high-grade black anodised aluminium|
Intel has employed the LGA (Land Grid Array) for attaching CPUs to their respective motherboards since 2004. Motherboards have, since that time, housed the connector pins that were previously attached to the underside of the CPU and - unlike AMD processors with PGA technology (Pin Grid Array), Intel CPUs have only had flat contact surfaces. To ensure that an Intel processor can remain securely seated in the socket, it is fastened into place using a foldable frame situated above the Integrated Heat Spreader (IHS).
Find out more about the der8auer Skylake-X Direct Die Frame on der8auer's Website.
The nickel-plated copper heat spreader, in the factory default setup, removes the heat produced by the CPU and transfers it into the CPU cooler which dissipates the thermal energy across a larger surface area than that available to the silicon alone. However the role of forming a tight seal between said components falls to a Thermal Interface Material (TIM) located between the heat spreader and the silicon chip. This standard thermal paste supplied with Intel processors offers relatively low levels of thermal conductivity, as a result of this it frequently struggles to maintain reasonable temperatures when faced with heavy overclocking.
In this scenario the effectiveness of the CPU cooler is irrelevant due to the fact that heat the heat build-up is taking place within the interior of the processor package itself. For a CPU to receive adequate cooling, even when being pushed to its limits via overclocking, enthusiasts swiftly remove the heat spreader with the help of the der8auer Delid Die Mate X, replacing the thermal paste with liquid metal and subsequently remounting the heat spreader. This results in a typical 10-20 °C reduction in the temperatures of Intel Skylake-X processors. The Skylake-X Direct Die Frame removes the need for two further layers consisting of the heat spreader and thermal paste, allowing temperatures to fall by a further 5-10 °C. This results in a marked improvement in overclocking performance.
The outer edge of the der8auer Skylake-X Direct Die Frame is located a mere 0,1 mm below the silicon chip itself, effectively preventing any unwanted tilting of the CPU cooler and protecting against damage. Furthermore, the black anodized coating isolates the aluminium of the Direct Die Frame as it is no longer electrically conductive. As a result the SK-X DDF can be seated safely and securely against the contact area of the CPU. Installation of the SK-X DDF requires that the Intel socket retention module first be removed, this then allows the bundled back plate to be attached to the reverse of the motherboard with adhesive pads, the CPU inserted, and the frame secured by means of four screws. The SK-X DDF is manufactured according to extremely tight tolerances to ensure an equal distribution of downward force. This helps to maintain optimum contact between the motherboard and CPU while ensuring all devices, such as PCIe cards or RAM modules, are recognized correctly.
Roman "der8auer" Hartung (pronounced: "der Bauer") is a trained mechatronics engineer (B.Eng.), hardware enthusiast and professional overclocker from Germany. In spite of his relatively young age he has been active in the extreme overclocking scene for many years and has set countless world records in this time. A passionate enthusiast of liberating every last ounce of performance from high-end hardware, the OC grand champion (as of August 2015) has taken second place in the professional "Elite" ranks of the best overclockers in the world (on HWBot.org). At Caseking der8auer offers a range of exclusive overclocking products to allow home users to enjoy achieving incredible overclocks themselves, massively overclocked extreme gaming systems for enthusiasts and overclocking bundles or custom LN2/DICE containers developed in-house for liquid nitrogen or dry ice cooling.